Liquid Cooling Technologies
SUNON Debuts New Products at the OCP Global Summit 2025
Kalin Ned — October 15, 2025
SUNON has introduced a new series of liquid cooling technologies at the OCP Global Summit 2025. The company presents these innovations as a foundational thermal management solution for modern high-density computing environments. The unveiled portfolio consists of several key components — an open-loop cold plate series designed for compatibility with major server CPUs, a modular coolant distribution unit that facilitates maintenance, and closed-loop systems that can be configured for a wide array of specific application needs.
SUNON's liquid cooling technologies are specifically architected for demanding applications such as artificial intelligence model training and advanced server processing. The company's core aim is to provide a modular, energy-conscious, and dependable method for heat dissipation within open compute frameworks.
At the OCP Global Summit 2025, SUNON's presentation focused on a 'Build to Chill' philosophy that emphasized a dual commitment to constructing high-performance cooling apparatus while ensuring that the operational outcome is characterized by stability, reduced acoustics, and unwavering reliability for end-users.
