Low-Temp Foam Technologies
DSC®'s DURAPONTEX® L-TAC Promises to Reduce Carbon by 50%
Kalin Ned — September 25, 2025
DahSheng Chemical (DSC) has introduced a new foam technology called DURAPONTEX® L-TAC. This material compound is designed for use in footwear components, such as insoles.
The primary innovation behind DURAPONTEX® L-TAC lies in its significantly reduced thermoforming temperature requirement, which is approximately 40 to 70 degrees Celsius lower than conventional foams. This lower thermal threshold offers a dual advantage — it diminishes the energy consumption and associated carbon emissions during the manufacturing process, and it allows the material to be used with a wider array of heat-sensitive textiles and leathers that would otherwise be damaged by standard high-temperature molding.
DSC's foam technology is engineered to be a direct substitute in existing production systems. The company claims that its implementation does not necessitate capital investment in new machinery.
