High-Speed TGV Inspections

High-speed TGV inspections are supporting next-generation semiconductor manufacturing with Spirox's SP7000G High-Speed TGV Crack Inspection System. Designed for Glass Core and Through-Glass Via production, the system uses laser tomography scanning to identify internal microcracks without damaging substrates. It can scan an entire 510 mm × 515 mm glass panel in under 20 minutes, allowing manufacturers to detect defects following metallization and ABF build-up processes while monitoring quality across production.

As AI servers, high-performance computing, and high-bandwidth memory increase demand for advanced packaging, manufacturers require faster methods for maintaining reliability at scale. The SP7000G could help semiconductor producers improve yields by identifying defects earlier and providing insight into their distribution. For Spirox, supporting both quality control and high-volume manufacturing creates opportunities to expand its inspection business as Glass Core and TGV technologies move toward broader commercial production.